Package: kmod-hwmon-w83793
Version: 4.14.131-1
Depends: kernel (=4.14.131-1-f908844d5e5aab0a4b27f7d4c77655d0), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: mipsel_24kc
Installed-Size: 14084
Description:  Kernel module for the Winbond W83793G and W83793R chips.
